Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2018
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Application #:
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15654512
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Filing Dt:
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07/19/2017
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Publication #:
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Pub Dt:
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11/02/2017
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Inventors:
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Yueh-Chuan LEE, Chia-Chan CHEN
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Title:
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METHOD FOR WAFER DICING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD.6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| R. BURNS ISRAELSEN |
| MASCHOFF BRENNAN |
| 1389 CENTER DR. SUITE 300 |
| PARK CITY, UT 84098 |
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