Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2018
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Application #:
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15619532
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Filing Dt:
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06/11/2017
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Publication #:
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Pub Dt:
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10/05/2017
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Inventors:
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Ziyang GAO, Xunqing SHI, Shi Wo CHOW
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Title:
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THREE DIMENSIONAL FULLY MOLDED POWER ELECTRONICS MODULE HAVING A PLURALITY OF SPACERS FOR HIGH POWER APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5/F, PHOTONICS CENTRE, 2 SCIENCE PARK EAST AVENUE |
HONG KONG SCIENCE PARK |
SHATIN, HONG KONG, CHINA |
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EAGLE IP LIMITED |
ROOM 509, GLOBAL GATEWAY TOWER, |
63 WING HONG STREET, LAI CHI KOK |
HONG KONG, CHINA |
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