Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2018
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Application #:
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14316724
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Filing Dt:
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06/26/2014
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Inventors:
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Weihsin Hou, Chin Siong Khor, Anoop Menon, Yean Chan Woon
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Title:
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Devices for Substrate Adhesion
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P O BOX 8102 |
| RENO, NEVADA 89507 |
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| LEE & HAYES, PLLC |
| 601 WEST RIVERSIDE |
| SUITE 1400 |
| SPOKANE, WA 99201 |
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