Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2018
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Application #:
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14683022
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Filing Dt:
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04/09/2015
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Publication #:
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Pub Dt:
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10/13/2016
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Inventors:
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Lin Cui, Jason Daejin Park
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Title:
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ELIMINATING FIRST WAFER METAL CONTAMINATION EFFECT IN HIGH DENSITY PLASMA CHEMICAL VAPOR DEPOSITION SYSTEMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4650 CUSHING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
| P.O. BOX 70250 |
| OAKLAND, CA 94612 |
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