Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2018
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Application #:
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15813617
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Filing Dt:
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11/15/2017
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Publication #:
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Pub Dt:
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05/31/2018
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Inventors:
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Katsumi Takada, Hiroshi KUROSAWA, Masayuki ITOH, YOSHINORI MESAKI
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Title:
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ELECTRONIC PART BONDING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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| SQUIRE PB (NVA/DC OFFICE) |
| 8000 TOWERS CRESCENT DRIVE |
| 14TH FLOOR |
| VIENNA, VA 22182-6212 |
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