Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/31/2018
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Application #:
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15088232
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Filing Dt:
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04/01/2016
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Publication #:
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Pub Dt:
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12/29/2016
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Inventors:
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Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang et al
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Title:
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BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & ASSOCIATES, LLC. |
| 629 EUCLID AVENUE, SUITE 1000 |
| NATIONAL CITY BANK BUILDING |
| CLEVELAND, OH 44114 |
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