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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/07/2018
Application #:
14841841
Filing Dt:
09/01/2015
Publication #:
Pub Dt:
03/02/2017
Inventors:
Shailesh N. Joshi, Masao Noguchi
Title:
Multi-Step Processes For High Temperature Bonding And Bonded Substrates Formed Therefrom
Assignment: 1
Reel/Frame:
036465/0595Recorded: 09/01/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/26/2015
Exec Dt:
08/26/2015
Assignee:
25 ATLANTIC AVENUE
ERLANGER, KENTUCKY 41018
Correspondent:
DINSMORE & SHOHL LLP
255 EAST FIFTH STREET, SUITE 1900
CINCINNATI, OH 45202
Assignment: 2
Reel/Frame:
046676/0065Recorded: 08/23/2018Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/20/2018
Assignee:
1, TOYOTA-CHO
TOYOTA-SHI
AICHI-KEN, JAPAN 471-8571
Correspondent:
DINSMORE & SHOHL LLP
255 EAST FIFTH STREET
SUITE 1900
CINCINNATI, OH 45202

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