Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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13844179
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Filing Dt:
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03/15/2013
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Inventors:
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Reza Argenty Pagaila, Byung Tai Do, Linda Pei Ee Chua
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4677 OLD IRONSIDES DRIVE |
| SUITE 370 |
| SANTA CLARA, CA 95054 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| ISHIMARU & ASSOCIATES LLP |
| 2055 GATEWAY PLACE |
| SUITE 700 |
| SAN JOSE, CA 95110 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4677 OLD IRONSIDES DRIVE |
| SUITE 370 |
| SANTA CLARA, CA 95054 |
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