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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/14/2018
Application #:
14554384
Filing Dt:
11/26/2014
Publication #:
Pub Dt:
05/26/2016
Inventors:
Tessil Thomas, Phani Kumar Kandula, Ramamurthy Krithivas, Howard Chin, Ian M. Steiner et al
Title:
APPARATUS AND METHOD FOR THERMAL MANAGEMENT IN A MULTI-CHIP PACKAGE
Assignment: 1
Reel/Frame:
034269/0205Recorded: 11/26/2014Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/26/2014
Exec Dt:
11/20/2014
Exec Dt:
11/24/2014
Exec Dt:
11/25/2014
Exec Dt:
11/24/2014
Exec Dt:
11/24/2014
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
TROP, PRUNER & HU, P.C.
1616 S. VOSS RD., SUITE 750
HOUSTON, TX 77057-2631

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