Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/14/2018
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Application #:
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15421737
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Filing Dt:
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02/01/2017
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Publication #:
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Pub Dt:
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05/25/2017
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Inventors:
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Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter et al
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Title:
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EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF FORMING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 309 |
| UGLAND HOUSE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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| HOFFMAN WARNICK LLC |
| 540 BROADWAY |
| 4TH FLOOR |
| ALBANY, NY 12207 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 303 TERRY FOX DRIVE |
| SUITE 300 |
| OTTAWA, CANADA K2K 3J1 |
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| ALSEPHINA INNOVATIONS INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| PO BOX 309, UGLAND HOUSE |
| MAPLES CORPORATE SERVICES LIMITED |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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| BENJAMIN PETERSEN |
| 1460 EL CAMINO REAL, 2ND FLOOR |
| SHEARMAN & STERLING LLP |
| MENLO PARK, CA 94025 |
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