Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/14/2018
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Application #:
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15439909
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Filing Dt:
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02/22/2017
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Publication #:
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Pub Dt:
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02/01/2018
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Inventors:
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Mingzhu WANG, Nan GUO, Bojie ZHAO, Zhenyu CHEN, Takehiko TANAKA, Zilong DENG
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Title:
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Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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66-68, SHUNYU ROAD, YUYAO, |
NINGBO, ZHEJIANG, CHINA 315400 |
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DAVID AND RAYMOND PATENT FIRM |
108 N. YNEZ AVE., SUITE 128 |
MONTEREY PARK, CA 91754 |
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05/02/2024 05:10 PM
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