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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/21/2018
Application #:
14800658
Filing Dt:
07/15/2015
Publication #:
Pub Dt:
01/21/2016
Inventors:
Bo-Yun JANG, Sun-Ho CHOI, Hee-Eun SONG
Title:
SILICON WAFER SLICING DEVICE USING WIRE DISCHARGE MACHINING
Assignment: 1
Reel/Frame:
036104/0168Recorded: 07/15/2015Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/13/2015
Exec Dt:
07/13/2015
Exec Dt:
07/13/2015
Assignee:
152, GAJEONG-RO, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 305-343
Correspondent:
LOWE HAUPTMAN & HAM, LLP
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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