Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2018
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Application #:
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14181305
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Filing Dt:
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02/14/2014
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Publication #:
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Pub Dt:
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08/20/2015
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Inventors:
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Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu
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Title:
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SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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SLATER & MATSIL, L.L.P. |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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