Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2018
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Application #:
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15576850
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Filing Dt:
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11/27/2017
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Publication #:
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Pub Dt:
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06/21/2018
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Inventors:
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Siyang LIU, Ning WANG, Jiaxing WEI, Weifeng SUN, Shengli LU, Longxing SHI, Chao LIU
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Title:
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Power Module of Square Flat Pin-Free Packaging Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2 SIPAI LOU, XUANWU NANJING, JIANGSU 210096 |
| NANJING, CHINA |
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| GOKALP BAYRAMOGLU |
| 2520 ST. ROSE PARKWAY, SUITE 309, HENDERSON |
| HENDERSON, NV 89074 |
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