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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/28/2018
Application #:
14740006
Filing Dt:
06/15/2015
Publication #:
Pub Dt:
10/08/2015
Inventors:
Hyun Jee YOO, Yoon Gyung CHO, Suk Ky CHANG, Jung Sup SHIM, Suk Chin LEE, Kwang Jin JEONG
Title:
ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
035839/0936Recorded: 06/15/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/26/2012
Exec Dt:
03/26/2012
Exec Dt:
03/26/2012
Exec Dt:
03/26/2012
Exec Dt:
03/26/2012
Exec Dt:
03/26/2012
Assignee:
128, YEOUI-DAERO, YEONGDEUNGPO-GU,
SEOUL, KOREA, REPUBLIC OF 150-721
Correspondent:
MCKENNA LONG & ALDRIDGE LLP
1900 K STREET, NW
WASHINGTON, DC 20006

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