Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/04/2018
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Application #:
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15518723
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Filing Dt:
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04/12/2017
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Publication #:
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Pub Dt:
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08/17/2017
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Inventors:
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Mitsuru Tanikawa, Takashi Watanabe, Yusuke Fujita, Yoshito Fujita, Tasuku Yamada
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Title:
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INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-4, NISHITEMMA 2-CHOME, KITA-KU |
| OSAKA-CITY, OSAKA, JAPAN 530-8565 |
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| LEE CHENG |
| 1133 13TH STREET N.W. STE C2 |
| WASHINGTON, DC 20005 |
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