Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/11/2018
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Application #:
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15649459
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Filing Dt:
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07/13/2017
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Inventors:
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Mark PAVIER, Wolfram HABLE, Angela KESSLER, Michael SIELAFF, Anton PUGATSCHOW et al
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Title:
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Molded package with chip carrier comprising brazed electrically conductive layers
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| CLIFFORD B. PERRY |
| 270 N. EL CAMINO REAL |
| NO. F-347 |
| ENCINITAS, CA 92024 |
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