Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/11/2018
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Application #:
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15460271
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Filing Dt:
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03/16/2017
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Publication #:
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Pub Dt:
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06/28/2018
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Inventors:
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Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin
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Title:
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PACKAGING STRUCTURE AND PACKAGING METHOD OF ELECTRONIC PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 25, GUANGPU W. RD., GUANGZHOU SCIENCE CITY |
| GUANGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
| GUANGZHOU, CHINA |
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| 22F, 392, RUEY KUANG ROAD, NEIHU |
| TAIPEI, TAIWAN 114 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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