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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/25/2018
Application #:
15289058
Filing Dt:
10/07/2016
Publication #:
Pub Dt:
01/26/2017
Inventors:
Weng Hong Teh, John S. GUZEK, Shan ZHONG
Title:
SEMICONDUCTOR PACKAGE HAVING SPACER LAYER
Assignment: 1
Reel/Frame:
057767/0328Recorded: 10/12/2021Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/04/2021
Assignee:
3600 BRIDGE PARKWAY
SUITE 102
REDWOOD CITY, CALIFORNIA 94065
Correspondent:
WILSON SONSINI GOODRICH & ROSATI
650 PAGE MILL ROAD
PALO ALTO, CA 94304

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