Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/02/2018
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Application #:
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14809533
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Filing Dt:
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07/27/2015
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Publication #:
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Pub Dt:
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11/19/2015
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Inventors:
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Yasuyuki Sekimoto, Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima
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Title:
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METHOD OF FORMING SOLDER BUMP, AND SOLDER BUMP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1 HIGASHIKOTARI 1-CHOME |
| NAGAKAKYO-SHI, KYOTO-FU, JAPAN 617-8555 |
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| 23 SENJUHASHIDOCHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| RICHARD LACAVA |
| 1675 BROADWAY |
| ARENT FOX |
| NEW YORK, NY 10019 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE 1ST ASSIGNEE ADDRESS CITY AND COUNTRY PREVIOUSLY RECORDED AT REEL: 036183 FRAME: 0798. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 10-1 HIGASHIKOTARI 1-CHOME |
| NAGAOKAKYO-SHI, KYOTO-FU, JAPAN 617-8555 |
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| 23 SENJUHASHIDOCHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| RICHARD LACAVA |
| 1675 BROADWAY |
| ARENT FOX |
| NEW YORK, NY 10019 |
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