Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/02/2018
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Application #:
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15669765
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Filing Dt:
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08/04/2017
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Publication #:
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Pub Dt:
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11/16/2017
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Inventors:
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Hsu-Che Nee, Chi-Bin Chen, Yi-Hsien Cheng
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Title:
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PACKAGED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6F, NO. 1, JINSHAN 8TH ST. |
| HSINCHU, TAIWAN 300 |
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| J.C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 206 ROOM, BLOCK A, UNISPLENDOUR INFORMATION HARBOR, NANSHAN DISTRICT, |
| SHENZHEN, CHINA 518052 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2702, UNIT 3, BUILDING 1, NO. 333, JIQING THIRD ROAD, CHENGDU HIGH TECH ZONE, |
| CHINA (SICHUAN) PILOT FREE TRADE ZONE, |
| CHENGDU, CHINA |
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| IP TRUST |
| 23428 SE 240TH PI. |
| MAPLE VALLEY, WA 98038 |
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