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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/09/2018
Application #:
15370328
Filing Dt:
12/06/2016
Publication #:
Pub Dt:
03/23/2017
Inventors:
Shinichiro TAKATANI, Hsien-Fu Hsiao, Cheng-Kuo LIN, Chang-Hwang HUA
Title:
METHOD FOR FABRICATING A SEMICONDUCTOR INTEGRATED CHIP
Assignment: 1
Reel/Frame:
041598/0118Recorded: 03/16/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/07/2017
Exec Dt:
02/07/2017
Exec Dt:
02/07/2017
Assignee:
NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK,
KUEI SHAN HSIANG, TAO YUAN SHIEN, TAIWAN
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PLLC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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