Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/16/2018
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Application #:
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15549271
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Filing Dt:
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08/07/2017
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Publication #:
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Pub Dt:
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02/01/2018
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Inventors:
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Sadatoshi SONODA, Takuji IWATANI, Kenichi MIYAZAKI
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Title:
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SEALING CAP FOR ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-6422 |
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| ORRICK, HERRINGTON & SUTCLIFFE LLP/VHS |
| 2050 MAIN STREET, SUITE 1100 |
| IRVINE, CA 92614 |
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