Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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15110576
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Filing Dt:
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07/08/2016
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Publication #:
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Pub Dt:
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11/10/2016
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Inventors:
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Shohei TAGAMI, Michihiro SUGO
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Title:
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WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16-1, OHTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED ON REEL 039109 FRAME 0859. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 6-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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