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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10109587
Issue Dt:
10/23/2018
Application #:
15226735
Filing Dt:
08/02/2016
Inventors:
Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung Moon Kim et al
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
Assignment: 1
Reel/Frame:
040254/0943Recorded: 11/08/2016Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PHU CUONG, DAO NGUYEN
Exec Dt:
08/04/2014
CHUNG FOH, BARTHOLOMEW LIAO
Exec Dt:
08/04/2014
DO, BYUNG TAI
Exec Dt:
07/29/2014
KIM, KYUNG MOON
Exec Dt:
07/11/2014
PUNZALAN, JEFFREY DAVID
Exec Dt:
07/29/2014
CHAI, SEUNGYONG
Exec Dt:
07/14/2014
LEE, SOO WON
Exec Dt:
06/27/2014
SZETO, KWOK KEUNG
Exec Dt:
07/29/2014
KIM, KYUNGOE
Exec Dt:
07/14/2014
Assignee:
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondent:
WONG & REES LLP
4340 STEVENS CREEK BLVD.
SUITE 106
SAN JOSE, CA 95129
Assignment: 2
Reel/Frame:
040581/0250Recorded: 11/09/2016Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
STATS CHIPPAC LTD.
Exec Dt:
03/29/2016
Assignee:
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65
#04-08/09 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondent:
WONG & REES LLP
4340 STEVENS CREEK BLVD.
SUITE 106
SAN JOSE, CA 95129

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