Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/30/2018
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Application #:
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15663189
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Filing Dt:
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07/28/2017
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Publication #:
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Pub Dt:
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02/15/2018
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Inventor:
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Kazuya Hirata
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Title:
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SiC WAFER PRODUCING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-11, OMORI-KITA 2-CHOME, OTA-KU, |
| TOKYO, JAPAN 143-8580 |
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| GREER, BURNS & CRAIN, LTD |
| 300 S. WACKER DR. |
| SUITE 2500 |
| CHICAGO, IL 60606 |
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Assignment:
2
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TERMINATION AND RELEASE OF SECURITY INTEREST
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| 195 S. MILPITAS BLVD. |
| MILPITAS, CALIFORNIA 95035 |
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| NAJEE THORNTON |
| 350 S GRAND AVENUE 50 FL |
| MUNGER, TOLLES & OLSON LLP |
| LOS ANGELES, CA 90071 |
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