Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/30/2018
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Application #:
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15817758
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Filing Dt:
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11/20/2017
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Publication #:
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Pub Dt:
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11/01/2018
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Inventors:
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Sung-Lien He, Chun-Yuan Hou, Tung-Chuan Wang, Hsi-Ying Yuan, Feng-Yi Chang
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Title:
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EMBEDDED SUBSTRATE PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 11, LANE 7, JIAFENG 10TH RD. |
| ZHUBIE CITY |
| HSINCHU COUNTY, TAIWAN 302 |
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| LIN & ASSOCIATES INTELLECTUAL PROPERTY, |
| PO BOX 2339 |
| SARATOGA, CA 95070-0339 |
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