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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/30/2018
Application #:
14316561
Filing Dt:
06/26/2014
Publication #:
Pub Dt:
12/31/2015
Inventors:
Xing Zhao, Siew Joo Tan, Duk Ju Na, Pandi C. Marimuthu
Title:
Semiconductor Device and Method of Forming Conductive Vias by Backside Via Reveal with CMP
Assignment: 1
Reel/Frame:
033191/0968Recorded: 06/26/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/11/2014
Exec Dt:
06/11/2014
Exec Dt:
06/11/2014
Exec Dt:
06/11/2014
Assignee:
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondent:
PATENT LAW GROUP: ATKINS AND ASSOCIATES
55 N. ARIZONA PLACE
SUITE 104
CHANDLER, AZ 85225
Assignment: 2
Reel/Frame:
051365/0680Recorded: 12/18/2019Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/28/2019
Assignee:
NO. 500 LINJIANG ROAD
YUECHENG DISTRICT
SHAOXING, CHINA
Correspondent:
ROBERT D. ATKINS
123 W. CHANDLER HEIGHTS ROAD, #12535
CHANDLER, AZ 85248

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