Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2018
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Application #:
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15193031
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Filing Dt:
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06/25/2016
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Publication #:
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Pub Dt:
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12/28/2017
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Inventors:
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Wei-Ping Chen, Tsung-Wei Wan
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Title:
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Bezels For Die Level Packaging Of Camera Modules, And Associated Camera Modules And Methods
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4275 BURTON DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| CURTIS A. VOCK LATHROP & GAGE LLP |
| 4845 PEARL EAST CIRCLE |
| SUITE 201 |
| BOULDER, CO 80301 |
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