Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/13/2018
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Application #:
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14674891
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Filing Dt:
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03/31/2015
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Publication #:
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Pub Dt:
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10/06/2016
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Inventors:
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Jerome Teysseyre, Yun Liu, Yonggang Jin
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Title:
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SEMICONDUCTOR PACKAGES WITH PILLAR AND BUMP STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| KAREN M. HENCKEL |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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