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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10145786
Issue Dt:
12/04/2018
Application #:
14784600
Filing Dt:
10/15/2015
Publication #:
20160069793
Pub Dt:
03/10/2016
Inventors:
Takayuki SHIMIZU, Nobuo TAKEDA, Keigo UHIRA, Nozomi SAITO, Toshio ABE, Shu MINAKUCHI
Title:
BONDED STRUCTURE AND BONDING-CONDITION DETECTING METHOD
Assignment: 1
Reel/Frame:
036797/0260Recorded: 10/15/2015Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SAITO, NOZOMI
Exec Dt:
10/07/2015
SHIMIZU, TAKAYUKI
Exec Dt:
10/07/2015
ABE, TOSHIO
Exec Dt:
10/07/2015
TAKEDA, NOBUO
Exec Dt:
10/14/2015
MINAKUCHI, SHU
Exec Dt:
10/14/2015
UHIRA, KEIGO
Exec Dt:
10/14/2015
Assignees:
MITSUBISHI HEAVY INDUSTRIES, LTD.
16-5, KONAN 2-CHOME, MINATO-KU
TOKYO, JAPAN 108-8215
THE UNIVERSITY OF TOKYO
3-1, HONGO 7-CHOME, BUNKYO-KU
TOKYO, JAPAN 113-8654
Correspondent:
WENDEROTH, LIND & PONACK, LLP
1030 15TH STREET, N.W.
SUITE 400 EAST
WASHINGTON, DC 20005

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