Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/25/2018
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Application #:
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14140692
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Filing Dt:
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12/26/2013
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Publication #:
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Pub Dt:
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07/02/2015
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Inventors:
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Kuan-Lin Ho, Sheng-Hsiang Chiu, Hsin-Yu Pan, Yu-Chih Liu, Chin-Liang Chen
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Title:
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Lid Design for Heat Dissipation Enhancement of Die Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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SLATER & MATSIL, L.L.P. |
17950 PRESTON ROAD |
SUITE 1000 |
DALLAS, TX 75252 |
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