Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/01/2019
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Application #:
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15841424
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Filing Dt:
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12/14/2017
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Inventors:
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Chun-Yang Su, Jhao-Shin Wang, Nian-Cih Yang, Xin-Wei Lo
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Title:
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CHIP PACKAGE HAVING A FLEXIBLE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN |
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| JACKSON INTELLECTUAL PROPERTY GROUP PLLC |
| 106 STARVALE LANE |
| SHIPMAN, VA 22971 |
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