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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/01/2019
Application #:
14740906
Filing Dt:
06/16/2015
Publication #:
Pub Dt:
10/01/2015
Inventor:
Keiji Matsumoto
Title:
ACHIEVING POWER SUPPLY AND HEAT DISSIPATION (COOLING) IN THREE-DIMENSIONAL MULTILAYER PACKAGE
Assignment: 1
Reel/Frame:
035846/0416Recorded: 06/16/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/26/2013
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION IP LAW DEPARTMENT
294 ROUTE 100
P.O. BOX 100
SOMERS, NY 10589-0100

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