Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/01/2019
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Application #:
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14478279
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Filing Dt:
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09/05/2014
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Publication #:
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Pub Dt:
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03/19/2015
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Inventors:
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Kyung Wook Baek, Keon Jae Lee, Yoo Sun Kim, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim
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Title:
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METHOD FOR PACKAGING FLEXIBLE DEVICE USING HOLDING WAFER, AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 291, DAEHAK-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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