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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10177069
Issue Dt:
01/08/2019
Application #:
15501374
Filing Dt:
02/02/2017
Publication #:
20170236768
Pub Dt:
08/17/2017
Inventors:
Motomune KODAMA, Shigeru KIKUCHI, Mutsuhiro MORI, Toshiaki MORITA, Taigo ONODERA et al
Title:
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
Assignment: 1
Reel/Frame:
041170/0543Recorded: 02/03/2017Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NAITO, TAKASHI
Exec Dt:
10/06/2016
KODAMA, MOTOMUNE
Exec Dt:
10/06/2016
AOYAGI, TAKUYA
Exec Dt:
10/07/2016
KIKUCHI (SIGNED ON BEHALF OF BY TAKASHI SUZUKI), SHIGERU
Exec Dt:
11/10/2016
NOGAWA, TAKASHI
Exec Dt:
10/06/2016
MORI, MUTSUHIRO
Exec Dt:
10/06/2016
IDE, EIICHI
Exec Dt:
10/06/2016
MORITA, TOSHIAKI
Exec Dt:
10/05/2016
KONNO, AKITOYO
Exec Dt:
10/06/2016
ONODERA, TAIGO
Exec Dt:
10/06/2016
MIYAKE, TATSUYA
Exec Dt:
10/06/2016
MIYAUCHI, AKIHIRO
Exec Dt:
10/06/2016
Assignee:
HITACHI LTD.
6-6, MARUNOUCHI 1-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-8280
Correspondent:
VOLPE AND KOENIG, P.C.
UNITED PLAZA
30 SOUTH 17TH STREET, 18TH FLOOR
PHILADELPHIA, PA 19103

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