Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/08/2019
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Application #:
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15831554
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Filing Dt:
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12/05/2017
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Publication #:
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Pub Dt:
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04/12/2018
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Inventors:
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James A. BUSBY, Michael A. GAYNES, William SANTIAGO-FERNANDEZ, Silvio DRAGONE et al
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Title:
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TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBSTRATE(S)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| KEVIN P. RADIGAN, ESQ. |
| HESLIN ROTHENBERG FARLEY & MESITI P.C. |
| 5 COLUMBIA CIRCLE |
| ALBANY, NY 12203 |
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