Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/29/2019
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Application #:
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15783384
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Filing Dt:
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10/13/2017
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Publication #:
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Pub Dt:
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02/21/2019
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Inventors:
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MASAAKI BANDOH, FUMITAKE MIZOGUCHI, OSAMU OHSAWA, HIROAKI KINOSHITA, TOMOO YAMADA et al
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Title:
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CONNECTOR SUBSTRATE ASSEMBLY, ELECTRONIC DEVICE, AND METHOD FOR ASSEMBLING ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01 NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| SHIMOKAJI & ASSOCIATES, P.C. |
| 8911 RESEARCH DRIVE |
| IRVINE, CA 92618 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23/F, LINCOLN HOUSE, 979 KING'S ROAD |
| HONG KONG, CHINA |
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| LENOVO |
| 8001 DEVELOPMENT DRIVE |
| MORRISVILLE, NC 27560 |
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