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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10197890
Issue Dt:
02/05/2019
Application #:
15317118
Filing Dt:
12/08/2016
Publication #:
20180113378
Pub Dt:
04/26/2018
Inventors:
Bojie Zhao, Takehiko Tanaka, Zhen Huang, Mingzhu WANG, Zhenyu Chen, Nan Guo et al
Title:
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
Assignment: 1
Reel/Frame:
040854/0349Recorded: 12/08/2016Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, MINGZHU
Exec Dt:
11/16/2016
ZHAO, BOJIE
Exec Dt:
11/21/2016
CHEN, ZHENYU
Exec Dt:
11/16/2016
TANAKA, TAKEHIKO
Exec Dt:
11/13/2016
GUO, NAN
Exec Dt:
11/16/2016
HUANG, ZHEN
Exec Dt:
11/16/2016
CHENG, DUANLIANG
Exec Dt:
11/16/2016
DING, LIANG
Exec Dt:
11/16/2016
CHEN, FEIFAN
Exec Dt:
11/16/2016
JIANG, HENG
Exec Dt:
11/17/2016
Assignee:
NINGBO SUNNY OPOTECH CO., LTD.
66-68, SHUNYU ROAD, YUYAO,
NINGBO, ZHEJIANG, CHINA 315400
Correspondent:
DAVID AND RAYMOND PATENT FIRM
108 N. YNEZ AVE., SUITE 128
MONTEREY PARK, CA 91754

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