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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10199284
Issue Dt:
02/05/2019
Application #:
15936825
Filing Dt:
03/27/2018
Inventors:
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De et al
Title:
Method for Processing a Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative of at Least One Tip-to-Tip Short or Leakage, at Least One Tip-to-Side Short or Leakage, and at Least One Chamfer Short or Leakage, Where Such Measurements Are Obtainedfrom Non-Contact Pads Associated with Respective Tip-to-Tip Short, Tip-to-Side Short, and Chamfer Short Test Areas
Assignment: 1
Reel/Frame:
045467/0534Recorded: 04/06/2018Pages: 18
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LAM, STEPHEN
Exec Dt:
04/21/2016
CIPLICKAS, DENNIS
Exec Dt:
04/15/2016
BROZEK, TOMASZ
Exec Dt:
04/20/2016
CHENG, JEREMY
Exec Dt:
05/06/2016
COMENSOLI, SIMONE
Exec Dt:
04/13/2016
DE, INDRANIL
Exec Dt:
04/12/2016
DOONG, KELVIN
Exec Dt:
04/28/2016
EISENMANN, HANS
Exec Dt:
04/26/2016
FISCUS, TIMOTHY
Exec Dt:
04/13/2016
HAIGH, JONATHAN
Exec Dt:
04/13/2016
HESS, CHRISTOPHER
Exec Dt:
04/12/2016
KIBARIAN, JOHN
Exec Dt:
04/18/2016
LEE, SHERRY
Exec Dt:
04/14/2016
LIAO, MARCI
Exec Dt:
04/15/2016
LIN, SHENG-CHE
Exec Dt:
04/28/2016
MATSUHASHI, HIDEKI
Exec Dt:
04/25/2016
MICHAELS, KIMON
Exec Dt:
04/18/2016
O'SULLIVAN, CONOR
Exec Dt:
04/21/2016
RAUSCHER, MARKUS
Exec Dt:
04/26/2016
ROVNER, VYACHESLAV
Exec Dt:
04/13/2016
STROJWAS, ANDRZEJ
Exec Dt:
04/28/2016
STROJWAS, MARCIN
Exec Dt:
04/13/2016
TAYLOR, CARL
Exec Dt:
04/13/2016
VALLISHAYEE, RAKESH
Exec Dt:
04/12/2016
WEILAND, LARG
Exec Dt:
04/21/2016
YOKOYAMA, NOBUHARU
Exec Dt:
04/13/2016
Assignee:
PDF SOLUTIONS, INC.
333 W. SAN CARLOS ST.
STE 1000
SAN JOSE, CALIFORNIA 95110
Correspondent:
DAVID GARROD, PH.D., ESQ.
711 IVY STREET
PITTSBURGH, PA 15232

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