Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/05/2019
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Application #:
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15937356
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Filing Dt:
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03/27/2018
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Inventors:
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Dennis Ciplickas, Jeremy Cheng, Indranil De, Hans Eisenmann, Jonathan Haigh, Stephen Lam et al
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Title:
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Method for Processing a Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative of at Least One Tip-to-Tip Short or Leakage, at Least One Side-to-Side Short or Leakage, and at Least One Via Open or Resistance, Where Such Measurements Are Obtained from Non-Contact Pads Associated with Respective Tip-to-Tip Short, Side-to-Side Short, and Via Open Test Areas
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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333 W. SAN CARLOS ST. |
STE 1000 |
SAN JOSE, CALIFORNIA 95110 |
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DAVID GARROD, PH.D., ESQ. |
711 IVY STREET |
PITTSBURGH, PA 15232 |
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