Patent Assignment Abstract of Title
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Total Assignments:
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Patent #:
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Issue Dt:
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02/05/2019
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Application #:
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15942485
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Filing Dt:
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03/31/2018
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Inventors:
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Dennis Ciplickas, Jeremy Cheng, Indranil De, Hans Eisenmann, Jonathan Haigh, Stephen Lam et al
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Title:
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Method for Processing a Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative of at Least One Chamfer Short or Leakage, at Least One Corner Short or Leakage, and at Least One Via Open or Resistance, Where Such Measurements Are Obtained from Non-Contact Pads Associated with Respective Chamfer Short, Corner Short, and Via Open Test Areas
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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333 W. SAN CARLOS ST. |
STE 1000 |
SAN JOSE, CALIFORNIA 95110 |
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DAVID GARROD, PH.D., ESQ. |
711 IVY STREET |
PITTSBURGH, PA 15232 |
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05/04/2024 03:41 PM
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