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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/05/2019
Application #:
15942485
Filing Dt:
03/31/2018
Inventors:
Dennis Ciplickas, Jeremy Cheng, Indranil De, Hans Eisenmann, Jonathan Haigh, Stephen Lam et al
Title:
Method for Processing a Semiconductor Wafer Using Non-Contact Electrical Measurements Indicative of at Least One Chamfer Short or Leakage, at Least One Corner Short or Leakage, and at Least One Via Open or Resistance, Where Such Measurements Are Obtained from Non-Contact Pads Associated with Respective Chamfer Short, Corner Short, and Via Open Test Areas
Assignment: 1
Reel/Frame:
045467/0534Recorded: 04/06/2018Pages: 18
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/21/2016
Exec Dt:
04/15/2016
Exec Dt:
04/20/2016
Exec Dt:
05/06/2016
Exec Dt:
04/13/2016
Exec Dt:
04/12/2016
Exec Dt:
04/28/2016
Exec Dt:
04/26/2016
Exec Dt:
04/13/2016
Exec Dt:
04/13/2016
Exec Dt:
04/12/2016
Exec Dt:
04/18/2016
Exec Dt:
04/14/2016
Exec Dt:
04/15/2016
Exec Dt:
04/28/2016
Exec Dt:
04/25/2016
Exec Dt:
04/18/2016
Exec Dt:
04/21/2016
Exec Dt:
04/26/2016
Exec Dt:
04/13/2016
Exec Dt:
04/28/2016
Exec Dt:
04/13/2016
Exec Dt:
04/13/2016
Exec Dt:
04/12/2016
Exec Dt:
04/21/2016
Exec Dt:
04/13/2016
Assignee:
333 W. SAN CARLOS ST.
STE 1000
SAN JOSE, CALIFORNIA 95110
Correspondent:
DAVID GARROD, PH.D., ESQ.
711 IVY STREET
PITTSBURGH, PA 15232

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