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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
02/05/2019
Application #:
13279571
Filing Dt:
10/24/2011
Inventors:
MOHSEN SHOKRANI, BORIS GEDZBERG, RON MICHELS
Title:
LOW COST METALLIZATION DURING FABRICATION OF AN INTEGRATED CIRCUIT (IC)
Assignment: 1
Reel/Frame:
027107/0988Recorded: 10/24/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/21/2011
Exec Dt:
10/21/2011
Exec Dt:
10/21/2011
Assignee:
141 MT. BETHEL RD
WARREN, NEW JERSEY 07059
Correspondent:
WILLIAM L. BOTJER
PO BOX 478
CENTER MORICHES, NY 11934
Assignment: 2
Reel/Frame:
042381/0761Recorded: 05/01/2017Pages: 7
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/29/2016
Assignee:
141 MOUNT BETHEL ROAD
WARREN, NEW JERSEY 07059
Correspondent:
DONALD BOLLELLA
5221 CALIFORNIA AVENUE, 21-1
IRVINE, CA 92617
Assignment: 3
Reel/Frame:
042551/0708Recorded: 05/24/2017Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/08/2017
Assignee:
20 SYLVAN ROAD
WOBURN, MASSACHUSETTS 01801
Correspondent:
DONALD BOLLELLA
5221 CALIFORNIA AVENUE, 21-1
IRVINE, CA 92617

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