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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/05/2019
Application #:
15627536
Filing Dt:
06/20/2017
Publication #:
Pub Dt:
04/19/2018
Inventors:
Seungwon KIM, Su-Jin KWON, Junwon HAN, Hyunwoo KIM, Byung Lyul PARK
Title:
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES
Assignment: 1
Reel/Frame:
042754/0485Recorded: 06/20/2017Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/08/2017
Exec Dt:
03/08/2017
Exec Dt:
03/08/2017
Exec Dt:
03/08/2017
Exec Dt:
04/20/2017
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE
SUITE 500
FALLS CHURCH, VA 22042

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