Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/12/2019
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Application #:
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14990891
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Filing Dt:
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01/08/2016
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Publication #:
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Pub Dt:
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07/21/2016
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Inventors:
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Chu-Chin Hu, Shih-Ping Hsu
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Title:
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ELECTRONIC PACKAGE AND CONDUCTIVE STRUCTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 458-17, XINXING RD., HUKOU TOWNSHIP |
| HSINCHU COUNTY 303, TAIWAN |
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| AMIN, TUROCY & WATSON, LLP |
| 57TH FLOOR, KEY TOWER |
| 127 PUBLIC SQUARE |
| CLEVELAND, OH 44114 |
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