Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/12/2019
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Application #:
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14861040
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Filing Dt:
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09/22/2015
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Publication #:
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Pub Dt:
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01/14/2016
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Inventors:
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Yaojian Lin, Kang Chen
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Title:
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Semiconductor Device and Method of Forming Wafer-Level Interconnect Structures with Advanced Dielectric Characteristics
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
TECHPOINT #04-08/09 |
SINGAPORE, SINGAPORE 569059 |
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PATENT LAW GROUP: ATKINS AND ASSOCIATES |
55 N. ARIZONA PLACE |
SUITE 104 |
CHANDLER, AZ 85225 |
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