Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/19/2019
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Application #:
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15512250
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Filing Dt:
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03/17/2017
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Publication #:
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Pub Dt:
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10/12/2017
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Inventors:
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Masato ICHIKAWA, Tsuyoshi ARAI, Atsushi KAWAMURA, Masami GOTOH
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Title:
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MOLDING DIE AND DIE-EXCHANGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P. O. BOX 828 |
| STANLEY M. ERJAVAC |
| BLOOMFIELD HILLS, MI 48303 |
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