Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/26/2019
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Application #:
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15171187
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Filing Dt:
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06/02/2016
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Publication #:
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Pub Dt:
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12/07/2017
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Inventors:
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Joshua Collins, Siew Neo, Hanna Bamnolker, Kapil Umesh Sawlani
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Title:
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ATOMIC LAYER DEPOSITION OF TUNGSTEN FOR ENHANCED FILL AND REDUCED SUBSTRATE ATTACK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4650 CUSHING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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