Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/05/2019
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Application #:
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15455879
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Filing Dt:
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03/10/2017
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Publication #:
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Pub Dt:
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03/15/2018
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Inventors:
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Gyu-hee PARK, Jae-soon LIM, Youn-joung CHO, Myong-woon KIM, Sang-ick LEE, Sung-duck LEE et al
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Title:
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ALUMINUM COMPOUND, METHOD OF FORMING THIN FILM BY USING THE SAME, AND METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 142, DAEHWA-RO 132BEON-GIL |
| DAEDEOK-GU, DAEJEON, KOREA, REPUBLIC OF 34366 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129 SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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