Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
03/05/2019
|
Application #:
|
15723111
|
Filing Dt:
|
10/02/2017
|
Publication #:
|
|
Pub Dt:
|
01/25/2018
| | | | |
Inventors:
|
Min-Ho Hsiao, Pang-Yen Lee, Yen-Hao Tseng
|
Title:
|
EMBEDDED PASSIVE CHIP DEVICE AND METHOD OF MAKING THE SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 1-1, LN. 111, SEC. 3 |
ZHONGSHAN RD., TANZI DIST. |
TAICHUNG CITY, TAIWAN |
|
|
|
WOMBLE BOND DICKINSON (US) LLP ATTN: IP |
P.O. BOX 7037 |
ATLANTA, GA 30357-0037 |
|
|
Search Results as of:
06/03/2024 07:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|